Shenzhen ampldk Detection Technology Service Co., Ltd is a company committed to the industrial field detection of the third party inspection agency. With professional and high-quality technical team, as well as "independent justice, accurate and efficient" service concept, to provide our customers with the best quality of the third party testing services.
Amp detection from the beginning of the establishment of strict accordance with the requirements of ISO/IEC 17025 management, and achieved Chinese conformity assessment National Committee approved in 2015 (CNAS No.L7973). The company has a number of advanced equipment and complete test functions of the laboratory, according to the GB, ISO, EN, DIN, ASTM, JIS, IEC and other national and international standards, in metal minerals, metal materials, building materials, auto parts, electroplating products, paint, environmental assessment and other fields to provide the most professional testing and technical service.
Professional team of experts with advanced equipment and efficient management = your 100% satisfaction!
The purpose of this laboratory is "accurate, efficient, impartial and confidential".
Company name: Shenzhen ampldk Detection Technology Services Limited (the company can supply the standard sample)
Company address: Baoan District, Songgang, Shenzhen Town, Jie Chang business building, 3 floor
Tel: 13226477363 Miss Tan online QQ:2955212153 mailbox: 2955212153@QQ.COM
Welcome to contact us if there is any relevant test requirement!
PCB slice analysis
Purpose:
Make a preliminary analysis of the quality judgment and the reasons for the bad by slicing and test the performance of the printed board. For example: resin contamination, coating crack, hole wall stratification, solder coating, interlayer thickness, coating thickness, hole thickness, lateral erosion, inner ring width, interlayer overlap, coating quality, hole wall roughness. The printed circuit board MICROSECTIONING micro slicing prepared can be used to check the PCB internal conductor layers, thickness, hole diameter, hole size, quality of observation, for internal inspection of PCBA solder joint void, interfacial bonding, wetting quality evaluation etc..
Application range:
PCB/PCBA, integrated circuits, etc..
Metallographic sections: also known as with special liquid resin sample package sealing, a sample preparation method and polishing, testing process including sampling, sealing, grinding, polishing, the morphology, size of the delamination cracking judgment, or the size of the data.
Main use: it is the most commonly used method to observe the structure of sample section.
1: after the biopsy sample or metallographic microscope stereo microscope measurement: combined with solid coatings or solder joints, joints, whether there are cracks or small gap (more than 1um); section morphology structure of cut surfaces of different components of the intermetallic compound morphology and size measurement; measuring microscope measurement the length and width of higher available cross-section structure parameters of electronic components of the solution; failure analysis when worn block structure is observed, and can reveal the need to observe, such as foreign bodies embedded parts, or observe the failure location.
2: slices of the sample can be used for SEM/EDS scanning electron microscopy and energy spectrum observation of morphology and analysis.
3: for non destructive testing, such as X-ray, SAM of the samples found suspected abnormal cracking, foreign objects embedded, etc., can be used to slice the method to observe and verify.
4: after the sample can be combined with the FIB, to do more subtle observation of the micro incision.
Restricted factors:
1: if the sample is greater than 5 cm X5 cm x2 cm, you need to cut and other methods of sampling and then sealed with grinding.
2: minimum observation length of 1 microns, and then a small need to use FIB to continue to do the micro incision.
3: the conventional curing ratio of fast curing results favorable, because less heat, slow speed, sealing, sample compression expansion force is small, the bond strength of solid sealing material and sample, sample and sealed with resin cracking occurs very rarely in the ground when the situation.
4: failure analysis method, careful operation, once the sample is sealed or removed, grinding, samples can not be restored.
Test procedure:
Sampling, cleaning, vacuum setting, grinding, polishing, micro etching (if necessary).
Based on standard:
IPC-TM 650 IPC-TM, 650-2.2.5 IPC, A 2.1.1 600, A IPC 610, etc.